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Polyimide plate heat resistant is a high-performance polymer sheet engineered for continuous service in extreme thermal and electrical environments. As a dedicated polyimide sheet manufacturer, we produce precision plates for demanding industrial applications where conventional plastics fail. The product is frequently specified as a polyimide sheet for high temperature insulation in stator slot liners, transformer spacers, and aerospace thermal barriers. Its low outgassing, high purity, and resistance to plasma etching make it a trusted PI sheet for semiconductor tooling, wafer handling fixtures, and chamber components. In electronics manufacturing, the same material is used as a PI sheet for flexible printed circuit stiffeners and substrates, providing excellent dimensional stability during solder reflow, wave soldering, and high-temperature lamination. These plates deliver consistent dielectric performance, low moisture absorption, and high mechanical strength at temperatures where traditional thermoplastics soften or degrade. Tight thickness control, uniform dielectric properties, and a clean surface finish ensure reliable performance across every batch, from prototype quantities to full production runs.


Polyimide Plate Heat Resistant offers a balanced combination of thermal stability, mechanical strength, and electrical insulation. The panels are manufactured from high-purity polyimide resin and cured under controlled conditions to minimize residual stress, warpage, and surface defects. They are suitable for continuous operation at temperatures up to 400°C, with short-term resistance to 500°C during intermittent exposure. The low thermal conductivity of this material minimizes heat transfer in insulation applications, while the high dielectric strength prevents electrical breakdown even at elevated temperatures. Unlike ceramic insulators, Polyimide Plate Heat Resistant does not crack under vibration or thermal shock, making it suitable for rugged electronic assemblies. Its moisture absorption remains below 0.4% after 24 hours, which helps maintain stable electrical properties in humid environments.

Typical product features include:

Detailed technical parameters for the standard heat-resistant grade are summarized below:

PropertyTypical ValueUnitTest Method
Density1.43g/cm³ASTM D792
Glass transition temperature (Tg)360–410°CDMA
Continuous operating temperature400°C
Thermal conductivity at 23°C0.25W/m·KASTM E1530
Dielectric strength (1 mm)22kV/mmASTM D149
Dielectric constant at 1 MHz3.4ASTM D150
Volume resistivity1.5 × 10¹⁶Ω·cmASTM D257
Water absorption (24 h)0.32%ASTM D570
Flammability ratingV-0UL 94
Flexural strength145MPaASTM D790
Tensile strength120MPaASTM D638
Coefficient of thermal expansion45–55ppm/°CASTM D696
Thickness tolerance±0.05mm

Standard panel sizes are 300 mm × 300 mm, 500 mm × 500 mm, and 600 mm × 1000 mm. Custom dimensions, thicknesses from 0.5 mm to 50 mm, and precision cut parts are available on request. The surface is matte on both sides to improve adhesion for potting or lamination, and panels can be supplied with a pressure-sensitive adhesive backing for easier integration into assemblies. For machining, carbide or diamond-tipped tools with low feed rates and adequate cooling are recommended. The material can be drilled, tapped, milled, and laser-cut to tight tolerances. Edges can be deburred or chamfered to specification. These processing options allow engineers to reduce assembly time and avoid secondary finishing steps.

Polyimide Plate Heat Resistant is commonly used in high-temperature gaskets, insulating washers, coil bobbins, heat shields, and structural components for downhole drilling tools, semiconductor equipment, and power electronics. Each production lot is tested for thickness tolerance (±0.05 mm for sheets under 10 mm), visual defects, and key electrical properties. Batch traceability and certificates of conformance are provided as standard. This level of quality control reduces rework in precision manufacturing and extends service life under repeated thermal cycling.

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