polyimide sheet manufacturer

As a specialized polyimide sheet manufacturer, we focus on high-performance polymer sheet production for industries where thermal stability, electrical insulation, and dimensional accuracy are non-negotiable. Our polyimide sheet for high temperature insulation is engineered for continuous service at 350°C and short-term exposure up to 480°C, making it suitable for transformers, motors, and aerospace thermal barriers. For wafer processing and test sockets, our PI sheet for semiconductor offers exceptionally low ionic contamination and high mechanical strength after repeated thermal cycling. Our polyimide plate heat resistant range includes rigid grades with excellent machinability for fixtures, insulators, and structural spacers. In flexible circuit manufacturing, our PI sheet for flexible printed circuit supports fine-line etching and reliable copper adhesion in roll-to-roll processes. We also maintain a large inventory of standard thicknesses to support rapid prototype and production orders.
Our polyimide sheet is produced using a controlled casting and thermal imidization method that delivers consistent properties across each lot. Unfilled and filled grades are available, including graphite-filled, glass-filled, and antistatic variants, to address specific heat dissipation, wear, or static control requirements. The base resin system provides an excellent balance of mechanical toughness, chemical resistance, and low outgassing under vacuum. Each production lot is tested for thickness uniformity, dielectric strength, tensile properties, and dimensional stability. We maintain ISO 9001 and ISO 14001 certified manufacturing processes, and material traceability is documented from resin batch to finished sheet. For applications requiring high-temperature outgassing control, our polyimide sheet is available in a pre-baked condition with total mass loss below 0.5% and collected volatile condensable material below 0.05% when tested per ASTM E595.

Key performance parameters include:

• Continuous use temperature: -269°C to +400°C depending on grade and load
• Flammability rating: UL94 V-0 with low smoke emission
• Dielectric strength: 22 kV/mm at 1.5 mm thickness
• Volume resistivity: 1.5 × 10^17 Ω·cm at 25°C
• Surface resistivity: 1.0 × 10^16 Ω
• Tensile strength: 165 MPa (machine direction), 140 MPa (transverse direction)
• Elongation at break: 55% at 25°C
• Water absorption: 0.8% after 24 h at 23°C
• Thermal conductivity: 0.25 W/m·K for unfilled resin; 1.2 W/m·K for graphite-filled
• Coefficient of linear thermal expansion: 45 ppm/°C between 25°C and 300°C

Thickness tolerance chart:

• 0.05 mm to 0.125 mm: ±0.008 mm
• 0.25 mm to 0.50 mm: ±0.015 mm
• 0.75 mm to 1.50 mm: ±0.025 mm
• 2.00 mm to 6.00 mm: ±0.050 mm
• Over 6.00 mm: ±0.100 mm

The table below summarizes additional measured values for standard amber polyimide sheet in 1.0 mm thickness:

Standard sheet sizes include 300 mm × 300 mm, 600 mm × 600 mm, and 1000 mm × 1000 mm. Thickness availability ranges from 0.05 mm film to 50 mm plate, with custom cut-to-size, CNC machining, drilling, and edge finishing available on request. Surface treatments such as corona, plasma, and chemical etching are offered to improve adhesive bonding for lamination, coating, or metal deposition processes. We also provide slitting and sheeting services for narrow rolls and custom sheet dimensions, with cleanroom packaging available for semiconductor and electronics applications. Typical applications include electrical insulation in traction motors, coil separators, thermal insulators in downhole tools, and structural components in semiconductor test equipment. The material is also specified for wave soldering pallets, compressor valve plates, and high-temperature gaskets where creep resistance and dimensional stability are critical.